Leading the leap in LED applications to promote the development of LED R&D in China

The aluminum profile is directly used as the heat sink substrate, which greatly reduces the manufacturing cost of the heat sink substrate. Through the implementation of this project, the thermal resistance of the high-power LED heatsink-based copper-clad printed circuit laminate can be reduced to below 0.25 °C/W, and its key technical indicators such as insulation resistance, breakdown voltage and thermal shock resistance. All of them meet the national military product standards and exceed the Japanese NRK similar product indicators, reaching the international advanced level.

The successful research and development of the product will lay a technical foundation for the large-scale and wide-area promotion and application of LED lighting. The industrialization of the product will drive the leap in LED application, promote the development of LED R&D in China to high-end technology, and effectively enhance the international competition of LED industry and enterprises. force. At the same time, it has greatly promoted the revitalization of national industry and upgraded the overall technical level of China's new energy industry. It will also provide important technical support for Jiangsu to become a major LED industry. The social and economic benefits of the project are significant.

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